GE IS210BPPCH1AD, IS200AEPAH1BMF I/O Pack Processor Board

Model:IS210BPPCH1AD & IS200AEPAH1BMF

Brand:General Electric (GE)

Type:I/O Pack Processor Board

Series:Mark VI

Dimensions:W: 29.2cm, D: 13cm, H: 2.7cm (IS210BPPCH1AD); W: 12.2cm, D: 8.2cm, H: 6cm (IS200AEPAH1BMF)

Weight:0.32kg (IS210BPPCH1AD); 0.38kg (IS200AEPAH1BMF)

Power Supply Voltage:9-32V DC

Operating Temperature:-20°C to +55°C

Storage Temperature:-40°C to +70°C

Communication Interface:RS-485, Modbus RTU

Input/Output Channels:32x Digital Inputs, 32x Digital Outputs

    Crafted with robust materials, the GE IS210BPPCH1AD & IS200AEPAH1BMF I/O pack processor boards are designed for optimal performance in harsh industrial conditions.

    These processor boards feature advanced processing technologies that enable efficient data management and control within complex automation systems.

    With its compact design and extensive connectivity options, the IS210BPPCH1AD & IS200AEPAH1BMF facilitates easy integration into existing systems, enhancing operational efficiency.

    The inclusion of 32 digital input and output channels ensures versatile control and monitoring capabilities, catering to diverse application needs in various industries.

    Equipped with an operating temperature range from -20°C to +55°C and storage capability from -40°C to +70°C, these processor boards are engineered to withstand extreme environmental challenges.

    Supporting RS-485 communication and Modbus RTU protocols, the IS210BPPCH1AD & IS200AEPAH1BMF facilitate seamless data exchange with other system components, optimizing performance and reliability.