GE PCIE-5565RC-100000 – PCI Express Reflective Memory (RFM) Node Card

Technical Specifications

• Manufacturer: GE Intelligent Platforms (Emerson/Abaco Systems)
• Model: PCIE-5565RC-100000
• Product Type: PCIe Reflective Memory (RFM) Node Card
• Bus Interface: PCIe x4 Gen1 (compatible with x8/x16 slots)
• Onboard Memory: 128 MB SDRAM
• Network Topology: Fiber-optic dual ring (LC duplex connector, 850 nm multimode)
• Serial Data Rate: 2.12 Gbaud (full-duplex)
• Sustained Throughput: 43–170 MB/s (dynamic packet size: 4–64 bytes)
• Node-to-Node Latency: 400–500 ns (deterministic)
• Max Network Nodes: 256
• Fiber Distance: Up to 300 m (OM3 multimode fiber)
• OS Support: Windows, Linux, VxWorks, QNX, INTEGRITY
• Operating Temperature: 0°C to +60°C (32°F to 140°F)
• Storage Temperature: -40°C to +70°C (-40°F to 158°F)
• Dimensions (L×W×H): 220 mm × 80 mm × 25 mm
• Weight: ~100 g
• Certifications: RoHS compliant, CE, UL (industrial EMC/safety)

Key Features

1. Deterministic Low-Latency Communication
   • Delivers 400–500 ns node-to-node latency with fixed, predictable transfer rates, ideal for real-time control and simulation.
   • Supports dynamic packet sizing (4–64 bytes) to optimize throughput for small, frequent control messages or large data blocks.
2. Software-Transparent Data Sharing
   • Data written to local SDRAM is automatically broadcast to all network nodes without CPU intervention, eliminating host processor overhead.
   • Enables seamless data sharing across heterogeneous systems (different OS/bus architectures) with no custom drivers required for basic operation.
3. High-Speed Fiber-Optic Ring Network
   • Uses 2.12 Gbaud fiber-optic signaling and a dual-ring topology for redundant, fault-tolerant communication.
   • Immune to electromagnetic interference (EMI) and noise, ensuring stable operation in harsh industrial environments.
4. Robust Industrial Design & Scalability
   • 128 MB onboard SDRAM provides fast local read access and supports large data sets for distributed processing.
   • Networks scale to 256 nodes with multimode fiber distances up to 300 m (single-mode option extends to 10 km).
   • Hot-swappable and RoHS-compliant, with a compact PCIe form factor for easy integration into industrial PCs and servers.
5. Comprehensive Error Management & Diagnostics
   • On-board error detection and correction (EDC) protect against data loss or corruption during transmission.
   • Supports interrupt transfers for event-driven data synchronization and real-time status monitoring.
   • LED indicators display power, link, and network status for quick troubleshooting.

Application Scenarios

• Real-Time Simulation & Test
  • Hardware-in-the-Loop (HIL) Simulation: Used in automotive, aerospace, and defense industries for real-time testing of engine control units (ECUs), flight controls, and weapon systems.
  • Distributed Test Rigs: Enables synchronized data sharing across multiple test nodes for vibration, thermal, and structural testing.
• Industrial Automation & Control
  • Distributed Process Control: Deployed in power generation (gas/steam turbines), oil & gas, and chemical plants for high-speed synchronization of PLCs, DCS, and remote I/O.
  • Motion Control: Supports multi-axis synchronization in high-speed manufacturing (e.g., semiconductor equipment, robotics) with deterministic latency.
• Aerospace & Defense
  • Flight Simulation: Connects multiple simulation nodes (cockpit, avionics, visual systems) for real-time, synchronized training environments.
  • Radar & Signal Processing: Enables low-latency data sharing between radar units, signal processors, and control systems in military applications.
• Distributed Computing & Data Acquisition
  • High-Speed Data Logging: Aggregates real-time data from multiple sensors and nodes in industrial IoT (IIoT) and smart factory applications.
  • Cluster Computing: Provides deterministic inter-node communication for embedded and industrial clusters requiring precise data synchronization。