GE IC693CHS391 – Series 90-30 10-Slot CPU Baseplate

In stock

Product Introduction:

The IC693CHS391, designed by GE Fanuc (now part of Emerson Automation), is a high-performance main baseplate for the GE Series 90-30 PLC system. It serves as the physical and electrical backbone that interconnects the CPU, power supply, and various I/O modules. It provides 10 slots for system configuration and integrates the backplane bus for high-speed data exchange and power distribution among modules. Engineered for rugged industrial environments, it ensures reliable long-term operation for centralized and distributed control systems.

Technical Specifications

Manufacturer: GE Fanuc (Emerson Automation)
Model: IC693CHS391
Series: GE Series 90-30 PLC System
Baseplate Type: Main CPU Baseplate
Total Slots: 10 slots
- Slot 0: Dedicated for CPU module
- Slot 1: Dedicated for power supply module
- Slots 2–9: For I/O and communication modules
Backplane Voltage: 5VDC
Backplane Current Consumption: 420mA @ 5VDC
Expansion Connector: 25-pin female (right side) for remote/expansion baseplates
Max Baseplate Support:
- 4 baseplates (CPU 331/340/341)
- 7 baseplates (CPU 350)
Dimensions (W×H×D): 330mm × 140mm × 110mm
Weight: 0.94kg (2.06lbs)
Operating Temperature: 0°C to +60°C
Storage Temperature: -40°C to +85°C
Relative Humidity: 5%–95% (non-condensing)
Isolation: 250VAC continuous (backplane-to-panel)
Protection Class: IP20
Mounting: DIN rail or panel mount (screw-fixed)
Material: High-strength engineering plastic with metal shielding
Certifications: CE, UL, CSA

Key Features

Modular 10-Slot Design: Dedicated slots for CPU and power supply, plus 8 flexible slots for I/O and communication modules, enabling customized system configurations.
High-Speed Backplane Bus: Integrates 5VDC power lines and RS-485 communication links for fast, noise-resistant data exchange between modules.
System Expandability: Supports up to 7 remote/expansion baseplates (CPU-dependent) via the 25-pin connector, scaling I/O capacity for large applications.
Robust Construction: Reinforced housing with EMC shielding provides resistance to vibration, shock, and electromagnetic interference in harsh industrial environments.
DIP Switch Configuration: Built-in DIP switches for setting baseplate address and communication parameters, simplifying system setup.
Hot-Swap Compatibility: Supports hot swapping of I/O modules (with compatible CPU) for maintenance without system shutdown.
Easy Installation: DIN rail clips and panel mounting holes allow quick, secure installation in control cabinets.