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GE IC695CHS007 – PACSystems RX3i 7-Slot Expansion Chassis

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Product Introduction:

The IC695CHS007 is a 7‑slot expansion chassis for the Emerson PACSystems RX3i PLC platform, designed to extend the I/O capacity of the main CPU rack. It provides seven additional slots for RX3i I/O modules (analog, discrete, communication), enabling scalable system configuration for large automation applications. Engineered for high‑speed backplane communication and rugged reliability, it supports hot‑swappable modules and seamless integration with the main rack, delivering flexibility and expandability for complex control systems.

Technical Specifications
  • Manufacturer: Emerson Automation (formerly GE Intelligent Platforms)
  • Model: IC695CHS007
  • Series: PACSystems RX3i PLC System
  • Chassis Type: 7‑slot expansion chassis
  • Number of Slots: 7 (for RX3i I/O modules)
  • Backplane Communication: High‑speed PCI‑based backplane (1Gbps)
  • I/O Module Compatibility: All RX3i analog, discrete, communication, and specialty modules
  • Power Supply: Requires RX3i power supply module (e.g., IC694PW330)
  • Backplane Power: 5VDC, 3.3VDC, 24VDC distributed via chassis
  • Mounting: DIN rail or panel mount
  • Operating Temperature: 0°C to +60°C
  • Storage Temperature: -40°C to +85°C
  • Certifications: CE, UL, CSA, RoHS, Class 1 Div 2
  • Dimensions: 350mm × 120mm × 40mm
  • Weight: 1.2kg
Key Features
  • 7 Expansion Slots: Adds seven additional I/O slots to the RX3i system, supporting up to 7 modules for increased I/O capacity.
  • High‑Speed Backplane: 1Gbps PCI‑based backplane ensures fast, deterministic communication between the CPU and expansion I/O modules.
  • Full Module Compatibility: Supports all RX3i I/O modules (analog, discrete, communication, specialty) for maximum system flexibility.
  • Hot‑Swappable Modules: Allows insertion/removal of I/O modules during system operation to minimize downtime.
  • Seamless Rack Integration: Connects to the main CPU rack via high‑speed cable, supporting up to 8 expansion chassis per system for large‑scale automation.
  • Rugged Industrial Design: Heavy‑duty metal construction withstands vibration, shock, and wide temperature ranges for reliable operation in harsh industrial environments.
  • Easy Installation: DIN rail or panel mount options simplify installation in control panels and industrial enclosures.
Application Scenarios
  • Large‑Scale Factory Automation: Expands I/O capacity for automotive assembly lines, packaging machinery, and material handling systems with extensive sensor/actuator requirements.
  • Process Plants: Supports large I/O configurations in chemical, petrochemical, and water treatment plants with numerous analog and discrete points.
  • Power & Energy: Expands monitoring and control capabilities for power distribution systems, renewable energy installations, and utility‑scale automation.
  • Building Automation: Scales I/O capacity for large commercial facilities, data centers, and hospitals with complex HVAC, lighting, and security systems.




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