GE IC695CPE302 – PACSystems RX3i High‑Performance CPU Module

In stock

Product Introduction:

The IC695CPE302 is a high‑performance CPU module for the Emerson PACSystems RX3i PLC platform, designed for mid‑range to complex industrial automation applications. It features a powerful 1GHz processor, ample memory, and multiple communication ports, delivering fast logic execution, real‑time data processing, and seamless network connectivity. Engineered for reliability and scalability, it supports extensive I/O expansion, advanced motion control, and complex process control algorithms, making it ideal for demanding manufacturing, process, and infrastructure applications.

Technical Specifications

Manufacturer: Emerson Automation (formerly GE Intelligent Platforms)
Model: IC695CPE302
Series: PACSystems RX3i PLC System
Processor: 1GHz 32‑bit RISC CPU
Memory: 2MB RAM (user program/data), 2MB non‑volatile flash (program storage)
Scan Rate: 0.9ms per 1000 Boolean instructions
Communication Ports:
- 1 × 10/100Mbps Ethernet (RJ45, Modbus TCP/IP, Ethernet/IP)
- 1 × RS‑232 (serial, Modbus RTU)
- 1 × USB 2.0 (programming, data transfer)
I/O Support: Up to 512 local I/O points; expandable to 8192 I/O points via expansion chassis
Programming Languages: Ladder Diagram (LD), Structured Text (ST), Function Block Diagram (FBD), C
Backplane Power: 1.2A @ 5VDC
Operating Temperature: 0°C to +60°C
Storage Temperature: -40°C to +85°C
Certifications: CE, UL, CSA, RoHS, Class 1 Div 2
Dimensions: 110mm × 80mm × 40mm
Weight: 0.5kg

Key Features

High‑Speed Processor: 1GHz 32‑bit RISC CPU delivers fast logic execution (0.9ms/k Boolean instructions) for complex control algorithms and real‑time applications.
Ample Memory: 2MB RAM and 2MB non‑volatile flash support large user programs, data logging, and recipe storage.
Multi‑Port Communication: Integrated Ethernet, RS‑232, and USB ports enable seamless connectivity to HMIs, SCADA systems, other PLCs, and programming devices.
Extensive I/O Expansion: Supports up to 512 local I/O points and 8192 total I/O points via expansion chassis, scalable for small to large automation systems.
Multi‑Language Programming: Supports LD, ST, FBD, and C programming languages, accommodating diverse programmer preferences and application requirements.
Hot‑Swappable: Allows replacement during system operation to minimize downtime in critical applications.
Rugged Industrial Design: Withstands vibration, shock, and wide temperature ranges for reliable operation in harsh industrial environments.