GE IC697BEM711 – Series 90‑70 Bus Receiver Module (BRM)

In stock

Product Introduction:

The IC697BEM711 is a high‑speed parallel bus receiver module for the Emerson (formerly GE Fanuc) Series 90‑70 PLC platform, designed to enable expansion from the main CPU rack to additional remote I/O racks. It acts as the interface between the main rack’s bus transmitter module (BTM) and remote racks, supporting high‑speed data exchange and distributed I/O configurations. Engineered for large‑scale industrial automation systems, it supports up to seven additional racks, 30 I/O nodes, and 15‑meter cable lengths, delivering reliable, deterministic communication for complex control applications.

Technical Specifications

Manufacturer: Emerson Automation (formerly GE Fanuc)
Model: IC697BEM711
Series: Series 90‑70 PLC System
Module Type: Bus Receiver Module (BRM)
Communication Ports: 2 × 25‑pin D‑shell (parallel bus)
Data Transfer Rate: 500kB/s
Max Cable Length: 15 meters (50 feet) between racks
Max Expansion Racks: 7 additional racks per system
Max I/O Nodes: 30 I/O nodes or subsystems
Isolation: Differential, non‑isolated
Backplane Power: 800mA @ 5VDC
LED Indicators: Module OK, Bus Active, Last Rack status LEDs
Response Time: <2ms
Operating Temperature: 0°C to +60°C
Storage Temperature: -40°C to +85°C
Certifications: CE, UL, CSA, RoHS
Dimensions: 200mm × 180mm × 30mm
Weight: 0.8kg

Key Features

High‑Speed Parallel Bus: 500kB/s data transfer rate ensures fast, deterministic communication between the main CPU rack and remote I/O racks.
Large‑Scale Expansion: Supports up to 7 additional racks and 30 I/O nodes, enabling scalable distributed I/O configurations for large automation systems.
Long Cable Support: Operates reliably with up to 15‑meter cables between racks, accommodating geographically spread I/O installations.
LED Status Indicators: Real‑time LEDs for Module OK, Bus Active, and Last Rack status enable quick diagnostics and troubleshooting.
Last‑State Retention: Maintains output module states during communication loss with the CPU, preventing system instability.
Passive Cooling: Fan‑less design reduces maintenance and eliminates dust ingress, enhancing reliability in harsh environments.
Rugged Industrial Design: Withstands vibration, shock, and wide temperature ranges for reliable operation in manufacturing and process plants.