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GE IC200CHS002 – VersaMax Box‑Style I/O Carrier

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Product Introduction:

The IC200CHS002 is a compact, box‑style I/O carrier from the GE Fanuc (now Emerson Automation) VersaMax series. It serves as a mechanical and electrical base that provides backplane communication, secure mounting, and field wiring termination for one VersaMax I/O module (analog or digital). Designed for high‑density, space‑saving installations, it bridges the PLC system and field devices in industrial automation.

Technical Specifications
  • Manufacturer: GE Fanuc / Emerson Automation
  • Model: IC200CHS002
  • Series: VersaMax PLC System
  • Type: Box‑style terminal I/O carrier
  • Terminals: 36 IEC box‑style terminals (A1–A18, B1–B18)
  • I/O Capacity: Up to 32 I/O points + 4 shared power/common connections
  • Voltage Rating: 0–264 VAC; 300 VAC transient protection
  • Current Rating: 2 A per I/O point; 8 A per power/ground line
  • Wire Gauge:
    • Single wire: AWG 14–22 (solid/stranded copper)
    • Two wires per terminal: AWG 18 max
  • Terminal Torque: 0.37–0.45 lb‑ft (0.5–0.6 N·m)
  • Mounting: Horizontal DIN rail (7.5 × 35 mm) or panel mount
  • Dimensions (W×H×D): 110 mm × 66.8 mm × 139.7 mm
  • Weight: 0.20 kg (0.44 lbs)
  • Operating Temperature: 0°C to +60°C
  • Storage Temperature: −40°C to +70°C
  • Relative Humidity: 5%–95% (non‑condensing)
  • Protection Class: IP20
  • Certifications: CE, UL, CSA
Key Features
  • Integrated Backplane Communication: Enables data exchange between the I/O module and PLC CPU without additional adapters.
  • High‑Density Termination: 36 terminals support up to 32 I/O points, reducing cabinet space.
  • Module Keying: Configurable mechanical keys prevent mismatched module insertion.
  • Hot‑Swap Compatible: Allows I/O module replacement without system shutdown.
  • Robust Construction: Industrial‑grade plastic housing with a transparent terminal cover for safety and visibility.
  • Flexible Mounting: Snaps onto standard DIN rails; panel‑mountable for high‑vibration environments.
  • EMC Compliance: Grounding provisions ensure electromagnetic noise immunity.
Application Scenarios
  • Industrial Automation: Assembly lines, material handling, and packaging systems.
  • Process Industries: Chemical, petrochemical, water/wastewater treatment plants.
  • Building Automation: HVAC, lighting control, and security systems in commercial facilities.
  • Power & Energy: Power generation, renewable energy, and utility monitoring systems.
  • Food & Beverage: Processing, bottling, and packaging lines requiring compact I/O solutions.




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